Titanium SET

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Titanium single-electron transistor fabricated by electron-beam lithography

We have fabricated non-superconducting mesoscopic tunnel junctions by oxidation of Ti. The fabrication process uses conventional electron-beam lithography and shadow deposition through an organic resist mask. Superconductivity in Ti is suppressed by performing the deposition under a suitable background pressure.

We have employed this method to make single-electron transistors which operated at T < 0.4 K and had a moderate charge noise of 2.5 x 10^(-3) e / sqrt(Hz) at 10 Hz. Based on nonlinearities in the current-voltage characteristics at higher voltages, we deduce the oxide barrier height of approximately 110 mV. The non-superconducting Ti junctions can be useful in several applications.

Physica E 15, 41 (2002)

Above: IV-characteristics of Ti SET in the Coulomb blockade regime, with two extreme gate voltages giving the largest and the smallest width of the Coulomb gap. Inset: image of a sample similar to the measured one. The tunnel junctions are marked by arrows.  



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Last updated: 10/13/04.